2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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Featured Product
ElectroCraft's Motion Control for Mobile Robots
ElectroCraft is showcasing its award-winning mobile robot technology including their powerful and compact wheel drives, high-torque-density brushless DC motors, precision linear actuators as well as servo motor drive technology at a variety of conferences and tradeshows including the Boston Robotics Summit. Robotics Summit is the premier symposium for the sharing of ideas, technology, and market developments for robotic technologies across industries. Beyond a showcase and pitch of product, ElectroCraft is eager to participate in the collaborative discussion of challenges and opportunities that will shape the near and long-term robotic marketplace.